MC-Solid 1331 BM
Solvent Free Two Component Thixotropic Epoxy Based Segment Adhesive
Properties
- Thixotropic grade Epoxy Adhesive
- High Bond Strength
- Solvent free
- Good Spread ability Under pressure
- Easy to mix and water tight
- Virtually Shrinkage free
- High Mechanical strength
- Easy to apply, Trowel able
Applications
- Bonding of Precast segments in bridges, Tunnels, etc
- For General bonding of different building materials on vertical faces (Concrete, Steel Stones, Iron, wood, etc)
- For leveling of Vertical and overhead surfaces
- For repair and corners and joint edges
- Epoxy for filling tie-rods, dowel holes
